An Evaluation of Beam-Damage Zone in Si Wafer Machined by Gatan MicroPREPTM Laser-Ablation
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DOI: 10.1017/s1431927618006219
Abstract: In synergy with the continuous miniaturization of semiconductor devices with nanometer transistors as the basic building blocks, teams of physical failure analysis (PFA) and transmission electron microscopy (TEM) in wafer-foundries have to constantly explore novel… read more here.
Keywords: evaluation beam; microscopy; wafer; damage zone ... See more keywords