Interfacial evolution in Sn–58Bi solder joints during liquid electromigration
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DOI: 10.1007/s10854-018-8907-5
Abstract: For Sn–58Bi low temperature solder alloy, local molten induced from electromigration Joule heating might change the atomic diffusion and interfacial behavior. In this paper, the diffusion behavior and interfacial evolution of Cu/Sn–58Bi/Cu joints were studied… read more here.
Keywords: interfacial evolution; electromigration; molten solder; solder ... See more keywords