Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer
Sign Up to like & getrecommendations! Published in 2017 at "Materials Characterization"
DOI: 10.1016/j.matchar.2017.01.035
Abstract: Abstract Ti 2 SnC, as one of functional ceramics with self-healing ability, was studied in welding with Ti6Al4V (TC4) through Cu interlayer under an applied mechanical pressure 10 MPa in Ar atmosphere. Electron probe microanalyses indicated… read more here.
Keywords: evolution bonding; mechanism ti2snc; interlayer; microstructure evolution ... See more keywords
Evolution of Bonding and Magnetism via Changes in Valence Electron Count in CuFe2-xCoxGe2.
Sign Up to like & getrecommendations! Published in 2022 at "Inorganic chemistry"
DOI: 10.1021/acs.inorgchem.1c02997
Abstract: A series of solid solutions, CuFe2-xCoxGe2 (x = 0, 0.2, 0.4, 0.8, and 1.0), have been synthesized by arc-melting and characterized by powder X-ray and neutron diffraction, magnetic measurements, Mössbauer spectroscopy, and electronic band structure… read more here.
Keywords: afm; structure; magnetism via; cufe2 xcoxge2 ... See more keywords