Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating
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DOI: 10.1007/s10854-020-04543-9
Abstract: To enhance the effects of electroless Ni–P plating on inhibiting atom diffusion in Sn-58Bi joint systems, adding nano-sized metals into coating was regarded as an efficient method. Therefore, Cu nanoparticles were chosen as the additive… read more here.
Keywords: interfacial microstructure; evolution solder; solder joints; electroless plating ... See more keywords