Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles
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DOI: 10.1007/s10854-018-0492-0
Abstract: This paper presents the influence of aging temperature as well as ZnO nanoparticles addition on the properties of Sn–0.7Cu solder. A series of Sn–0.7Cu–ZnO composite solders with ZnO nanoparticles traces (0, 0.1, 0.25, 0.5 and… read more here.
Keywords: evolution tensile; tensile creep; microstructure evolution; solder ... See more keywords