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Published in 2018 at "IEEE Microwave Magazine"
DOI: 10.1109/mmm.2017.2759541
Abstract: This article outlines a number of inkjet-/threedimensional (3-D)-printed prototypes of RF and millimeter-wave (mmW) components, interconnects, and systems. We pay special attention to the major challenges related to applying current multidimensional printing technologies to the…
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Keywords:
components interconnects;
printing new;
new applications;
millimeter wave ... See more keywords