A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2936514
Abstract: Cu pattern-laminated fabric substrates using epoxy-based B-stage adhesive films were demonstrated. Fine-pitch Cu electrical patterns were fabricated on B-stage adhesive films and then laminated to fabrics. As a result, fabric substrates having minimum Cu line… read more here.
Keywords: fine pitch; stage adhesive; fabric substrates; adhesive films ... See more keywords