Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.
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DOI: 10.1021/acsnano.8b00180
Abstract: Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to… read more here.
Keywords: three dimensional; silicon electronic; electronic systems; dimensional silicon ... See more keywords