Interfacial reaction during fabricating of full Cu3Sn joints in microelectronic packaging
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DOI: 10.1080/02670836.2017.1342365
Abstract: ABSTRACT Two copper substrates electroplated with Sn, both consisted of Cu/Sn + Sn/Cu structures, but they were bonded over different times in order to investigate the interfacial reaction. The growth morphologies of Cu6Sn5 and Cu3Sn were analysed,… read more here.
Keywords: reaction fabricating; cu3sn; fabricating full; reaction ... See more keywords