Study on Warpage and Reliability of Fan-Out Interposer Technology
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2018.2889308
Abstract: The fan-out interposer (FOI) technology with fine pitch is demonstrated and presented for heterogeneous integration as a cost-effective and enabling technology. The co-design modeling methodology is established for the FOI technology, including wafer process-induced warpage,… read more here.
Keywords: warpage; technology; reliability; fan interposer ... See more keywords