Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
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DOI: 10.1109/tcpmt.2017.2726084
Abstract: Nowadays, fan-out package is regarded as one of the latest and most potential technologies because it possesses lower cost, thinner profile, and better electrical performance and thermal performance. However, thermally induced warpage in the molding… read more here.
Keywords: process; geometry; fan package; warpage ... See more keywords