Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2019.2952238
Abstract: In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance… read more here.
Keywords: pcb; embedded package; power; fan panel ... See more keywords
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2018.2848665
Abstract: The design, materials, process, fabrication, and reliability of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this paper. Emphasis is placed on the application of a special… read more here.
Keywords: panel level; heterogeneous integration; level packaging; fan panel ... See more keywords