Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
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DOI: 10.1109/ectc.2017.309
Abstract: In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip… read more here.
Keywords: wafer level; level packaging; warpage thermal; warpage ... See more keywords
Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.2992041
Abstract: This article aims to characterize the warpage evolution of fan-out wafer-level packaging (FOWLP) during the wafer-level mold cure process. A finite-element analysis (FEA)-based process modeling framework, which includes the effects of geometric nonlinearity, gravity, and… read more here.
Keywords: warpage; process; fan wafer; cure ... See more keywords
Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process
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DOI: 10.3390/ma15051683
Abstract: This paper focuses on characterizing the evolution of warpage, effects of epoxy molding compound (EMC), and effects of carrier 2 (the second carrier in the process) of 12 inch RDL-first multi-die fan-out wafer-level packaging (FOWLP)… read more here.
Keywords: multi die; warpage; carrier; fan wafer ... See more keywords