The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films
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DOI: 10.1016/j.tsf.2016.11.047
Abstract: In this work we studied the impact of pulse electroplating parameters on the cross-sectional and surface microstructures of blanket copper films using electron backscattering diffraction and x-ray diffraction. The films evaluated were highly (111) textured… read more here.
Keywords: pulse plating; copper; influence pulse; stress ... See more keywords