Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)
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DOI: 10.1016/j.applthermaleng.2020.115230
Abstract: Abstract We propose a liquid cooling system incorporating a porous medium combined to the multiscale flow manifold. Specifically, this work compares two types of porous media by varying the porosity: the first type only includes… read more here.
Keywords: metal; metal foam; liquid cooling; fin hybrid ... See more keywords