Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
Sign Up to like & getrecommendations! Published in 2020 at "Materials Chemistry and Physics"
DOI: 10.1016/j.matchemphys.2020.123680
Abstract: Abstract The fine-pitch and small line width Cu redistribution lines (RDLs) serve as the key factor in achieving high-density advanced fan-out packaging products. However, the dimension scaling of the next generation Cu RDL will cause… read more here.
Keywords: fine pitch; current density; high current; electromigration ... See more keywords
Transferable-Tip Technology for Fine-Pitch Probes and Interconnections
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2925589
Abstract: A transferable-tip technology has been developed that has applications for wafer-level fine-pitch probe and electrical test of semiconductor devices. The tips are made by filling a mold made in a (100)-oriented Si substrate wafer, with… read more here.
Keywords: transferable tip; test; fine pitch; tip technology ... See more keywords
A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2936514
Abstract: Cu pattern-laminated fabric substrates using epoxy-based B-stage adhesive films were demonstrated. Fine-pitch Cu electrical patterns were fabricated on B-stage adhesive films and then laminated to fabrics. As a result, fabric substrates having minimum Cu line… read more here.
Keywords: fine pitch; stage adhesive; fabric substrates; adhesive films ... See more keywords
MEMS-based Ni–B probe with enhanced mechanical properties for fine pitch testing
Sign Up to like & getrecommendations! Published in 2017 at "Micro and Nano Systems Letters"
DOI: 10.1186/s40486-016-0039-1
Abstract: We fabricated and characterized microelectromechanical systems (MEMS)-based Ni–B probes with enhanced mechanical properties for fine pitch testing. The Ni–B micro-probes were compared with conventional Ni–Co micro-probes in terms of the mechanical performance and thermal effect.… read more here.
Keywords: fine pitch; pitch testing; mems based; micro ... See more keywords