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Published in 2020 at "Engineering Failure Analysis"
DOI: 10.1016/j.engfailanal.2020.104682
Abstract: Abstract The interfacial reliability of Au-Si bonding between Cu/MoCu/Cu (named as CPC) substrate and silicon chip is analyzed. The results of optical microscopy (OM) and conformal laser scanning microscopy (CLSM) revealed that the Au layer…
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Keywords:
finish layer;
microscopy;
layer;
nico layer ... See more keywords
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Published in 2021 at "Advances in Materials Science and Engineering"
DOI: 10.1155/2021/3438613
Abstract: The building finish layer is a comprehensive structural system including the building exterior insulation system and building exterior finish. Combining with buildings has the advantage of reducing wall heat loss and building deformation caused by…
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Keywords:
finish layer;
temperature;
anchor bolt;
thermomechanical coupling ... See more keywords