Flexible and adhesive sintered Cu nanomaterials on polyimide substrates prepared by combining Cu nanoparticles and nanowires with polyvinylpyrrolidone
Sign Up to like & getrecommendations! Published in 2021 at "Colloids and Surfaces A: Physicochemical and Engineering Aspects"
DOI: 10.1016/j.colsurfa.2021.126907
Abstract: Abstract Adhesive sintered Cu nanoparticles (NPs) with low resistivity (41.0 µΩ cm) were formed on polyimide (PI) substrates using well-dispersed Cu NP inks containing polyvinylpyrrolidone (PVP), and their flexibilities were improved by combining the Cu… read more here.
Keywords: polyvinylpyrrolidone; pvp; flexible adhesive; adhesive sintered ... See more keywords