Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds
Sign Up to like & getrecommendations! Published in 2021 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2021.149220
Abstract: Abstract Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive polyethylene terephthalate (PET) substrate by combining the inkjet print with copper nanoparticles (Cu NPs) conductive ink… read more here.
Keywords: electroless plating; copper; fabrication flexible; copper patterns ... See more keywords
Photosensitive hybrid polysilsesquioxanes for etching-free processing of flexible copper clad laminate
Sign Up to like & getrecommendations! Published in 2021 at "Composites Science and Technology"
DOI: 10.1016/j.compscitech.2020.108556
Abstract: Abstract A photosensitive ladder-structured polysilsesquioxane was synthesized for the development of flexible copper clad laminates through electroless plating of Cu. The developed ladder-structured polysilsesquioxane with controlled structure enabled easy introduction of protected thiol and allyl… read more here.
Keywords: hybrid polysilsesquioxanes; flexible copper; copper clad; photosensitive hybrid ... See more keywords