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Published in 2025 at "Polymer Composites"
DOI: 10.1002/pc.29691
Abstract: As the power density of integrated circuits in electronic devices continues to rise, thermal management has emerged as a critical technical barrier limiting performance enhancement. To address this challenge, an innovativeāoriented filler strategy has been…
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Keywords:
material;
thermal interface;
vertically oriented;
continuous carbon ... See more keywords
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Published in 2024 at "ACS nano"
DOI: 10.1021/acsnano.4c06952
Abstract: Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled lamella thickness, pore structure,…
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Keywords:
thermally conductive;
lamella;
highly thermally;
thermal interface ... See more keywords