An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Low Temperature Physics"
DOI: 10.1007/s10909-018-2013-1
Abstract: A detector head for an energy-dispersive X-ray spectroscopy (EDS) for a scanning transmission electron microscope (STEM) was designed, fabricated, and tested. A 64-pixel TES X-ray microcalorimeter and 64 SQUID array amplifiers (SAAs) are mounted on… read more here.
Keywords: head; detector head; eds system; flip chip ... See more keywords
Design of patterned sapphire substrates in flip-chip LEDs for improvement of light-extraction efficiencies
Sign Up to like & getrecommendations! Published in 2018 at "Optical and Quantum Electronics"
DOI: 10.1007/s11082-018-1414-3
Abstract: Patterned sapphire substrates (PSSs) in flip chip light-emitting diodes (FC-LEDs) were designed to improve the light extraction efficiencies (LEEs). Two typical types were considered in the cross-section of the PSS pattern; an extruded type and… read more here.
Keywords: patterned sapphire; flip chip; light extraction; extraction efficiencies ... See more keywords
Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-020-08514-y
Abstract: Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced significantly. This trend currently leads to an increased amount of current density… read more here.
Keywords: oriented failure; flip chip; electromigration; electromigration oriented ... See more keywords
Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-020-08523-x
Abstract: The wettability and growth of intermetallic compounds (IMCs) of stud bump materials Ag, Ag-4Pd, Cu, and Au with Sn-3Ag-0.5Cu (SAC305) solder have been investigated. Stud bumps produced using wire bonding techniques are widely employed in… read more here.
Keywords: 3ag 5cu; stud bumps; 4pd stud; flip chip ... See more keywords
Shear test on hard coated flip-chip bumps to measure back end of the line stack reliability
Sign Up to like & getrecommendations! Published in 2017 at "Engineering Fracture Mechanics"
DOI: 10.1016/j.engfracmech.2017.04.010
Abstract: Abstract Introduction of ultra-low κ (ULK) material into advanced back end of line (BEOL) stacks has improved the electrical performance of the flip-chip microelectronic packages. However, the integration of the brittle and porous ULK materials… read more here.
Keywords: flip chip; reliability; failure; bump ... See more keywords
High reliable and chromaticity-tunable flip-chip w-LEDs with Ce:YAG glass-ceramics phosphor for long-lifetime automotive headlights applications
Sign Up to like & getrecommendations! Published in 2017 at "Optical Materials"
DOI: 10.1016/j.optmat.2017.04.019
Abstract: Abstract Nowadays, major commercial w-LEDs fabricated by the traditionally gold-wire-welding packaging technology have undergone considerable development as indoor/outdoor lighting sources due to its high-energy utilization efficiency, long service life, environmental friendliness, and excellent chromatic stability.… read more here.
Keywords: yag glass; flip chip; glass; glass ceramics ... See more keywords
Increased Light Extraction of Thin-Film Flip-Chip UVB LEDs by Surface Texturing
Sign Up to like & getrecommendations! Published in 2023 at "ACS Photonics"
DOI: 10.1021/acsphotonics.2c01352
Abstract: Ultraviolet light-emitting diodes (LEDs) suffer from a low wall-plug efficiency, which is to a large extent limited by the poor light extraction efficiency (LEE). A thin-film flip-chip (TFFC) design with a roughened N-polar AlGaN surface… read more here.
Keywords: flip chip; light extraction; film flip; efficiency ... See more keywords
Flip-Chip-Based Microwave Spectroscopy of Andreev Bound States in a Planar Josephson Junction
Sign Up to like & getrecommendations! Published in 2022 at "Physical Review Applied"
DOI: 10.1103/physrevapplied.19.054026
Abstract: We demonstrate a flip-chip-based approach to microwave measurements of Andreev bound states in a gate-tunable planar Josephson junction using inductively-coupled superconducting low-loss resonators. By means of electrostatic gating, we present control of both the density… read more here.
Keywords: bound states; flip chip; andreev bound; spectroscopy ... See more keywords
Flip-Chip Integration of InP and SiN
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Photonics Technology Letters"
DOI: 10.1109/lpt.2019.2892851
Abstract: We present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-nitride-based photonic platforms. The design enables efficient high optical power coupling over a wide temperature range. The optical modes of laser and… read more here.
Keywords: chip integration; flip chip; integration; integration inp ... See more keywords
Compact 60 GHz Phased-Array Antennas With Enhanced Radiation Properties in Flip-Chip BGA Packages
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Antennas and Propagation"
DOI: 10.1109/tap.2018.2888810
Abstract: Compact phased-array antennas embedded in flip-chip ball grid array (BGA) packages are proposed to operate over the unlicensed 60 GHz frequency band. Radiation properties are enhanced by designing novel corrugated soft-surface structures and implementing them… read more here.
Keywords: flip chip; ghz; bga packages; chip ... See more keywords
High-Efficiency Revolving-Turret Chip Transferring Technology for Flip Chip Packaging
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2760342
Abstract: With the rapid growth of the microelectronic packaging market, it is necessary to increase the throughput and reduce the cost of flip chip. Driven by these evolutions, a novel revolving-turret chip transferring (RTCT) technology is… read more here.
Keywords: flip chip; chip packaging; technology; packaging ... See more keywords