LAUSR

Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF

Sign Up to like & get
recommendations!
0 Published in 2017 at "Mechanical Systems and Signal Processing"

DOI: 10.1016/j.ymssp.2016.09.030

Abstract: Abstract Flip chip technology combined with solder bump interconnection has been widely applied in IC package. The solder bumps are sandwiched between dies and substrates, leading to conventional techniques being difficult to diagnose the flip… read more here.

Keywords: flip; vibration; analysis; nondestructive diagnosis ... See more keywords