Depth profiling and standardization from the back side of a sample for accurate analyses: Emphasis on quantifying low‐fluence, shallow implants in diamond‐like carbon
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DOI: 10.1002/rcm.9454
Abstract: Rationale Back‐side thinning of wafers is used to eliminate issues with transient sputtering when analyzing near‐surface element distributions. Precise and accurate calibrated implants are created by including a standard reference material during the implantation. Combining… read more here.
Keywords: low fluence; fluence shallow; depth profiling; side ... See more keywords