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Published in 2019 at "Materials Letters"
DOI: 10.1016/j.matlet.2019.06.029
Abstract: Abstract This paper introduces a novel method to moderate the residual stress in a YSZ/Ti6Al4V alloy by using novel CuO nanostructure reinforced Cu foam (N-Cu foam) interlayer. The microstructure of the CuO nanostructure reinforced Cu…
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Keywords:
interlayer;
foam interlayer;
nanostructure reinforced;
reinforced foam ... See more keywords