Biomimetic Copper Forest Wick Enables High Thermal Conductivity Ultrathin Heat Pipe.
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DOI: 10.1021/acsnano.0c09961
Abstract: Electronic devices with high heat flux are currently facing heat dissipation problems. Heat pipes can be used as efficient heat spreaders to address this critical problem. However, as electronic devices become smaller, the space for… read more here.
Keywords: copper forest; biomimetic copper; ultrathin heat; wick ... See more keywords