Foreword to the special virtual issue dedicated to the proceedings of the PhotonMEADOW2023 Joint Workshop
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DOI: 10.1107/s1600577524008816
Abstract: Foreword to the virtual issue papers from the PhotonMEADOW2023 workshop. read more here.
Keywords: foreword special; virtual issue; foreword; special virtual ... See more keywords
Editorial Foreword to the Special Issue on Recent Advances in Multitemporal Remote-Sensing Data Processing
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DOI: 10.1109/jstars.2022.3140594
Abstract: This special issue of the IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing (JSTARS) contains 11 papers both from the extended outcomes of the Multitemp 2019 presented papers, and from the… read more here.
Keywords: remote sensing; editorial foreword; issue recent; foreword special ... See more keywords
Foreword to the Special Issue “Exploring the Potential of Urban Remote Sensing”
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DOI: 10.1109/jstars.2025.3559018
Abstract: Urban growth and decline, changing urban patterns, densification, conversion, or deconstruction of the built landscape, gain, loss or alteration of natural space, socioeconomic inequalities, variabilities of structural types within and across cities, efficiency of land… read more here.
Keywords: sensing foreword; special issue; foreword special; exploring potential ... See more keywords
Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2)
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DOI: 10.1109/tcpmt.2017.2787938
Abstract: With the emergence of new technical trends such as Internet of Things, Big Data, wearable electronics, automotive electronics, and 3-D printing, the role of electrical design of packages and package-based systems is more important than… read more here.
Keywords: special section; section recent; electrical design; foreword special ... See more keywords
Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part I
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2936963
Abstract: In a world of digitally native citizens, processors and memory are common topics of conversation, no longer restricted to the engineering community. It is only natural. After all, one does not need to be an… read more here.
Keywords: special section; section packaging; foreword special; characterization ... See more keywords
Foreword: Special Section on Electrical Performance for Highly Integrated Systems
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.3035950
Abstract: Not a day goes by without the issue of global warming and the depletion of the planet’s resources being addressed in the media. And it is clear that the societal and environmental challenges posed are… read more here.
Keywords: special section; performance highly; highly integrated; foreword special ... See more keywords