Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder
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DOI: 10.3390/ma16082991
Abstract: This research aimed to study a Bi–Ag–Mg soldering alloy and the direct soldering of Al2O3 ceramics and Ni–SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content.… read more here.
Keywords: ceramic composite; solder; study bond; bond formation ... See more keywords