A Review on Phase Field Modeling for Formation of η-Cu6Sn5 Intermetallic
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DOI: 10.3390/met12122043
Abstract: Formation of intermetallic compounds (IMCs) exhibits remarkable microstructural features and provides opportunities for microstructure control of microelectronic interconnects. Excessive formation of brittle IMCs at the Cu/Sn interface such as η-Cu6Sn5 can deteriorate the reliability and… read more here.
Keywords: formation; phase field; modeling formation; formation cu6sn5 ... See more keywords