A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-8340-1
Abstract: In electronic packaging in recent years, silver (Ag) alloy wires have been widely adopted in wire-bond processes. The bond pads on the device chips are mostly aluminum (Al). Thus, the bonding interface is mainly Ag–Al.… read more here.
Keywords: formation system; mechanical properties; indentation; intermetallic compound ... See more keywords