Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor
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DOI: 10.1039/c8nj04173c
Abstract: The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a bonding material to replace Pb-containing alloys, undesired deposits are observed. To understand this phenomenon, the mass… read more here.
Keywords: acid vapor; tin based; formation tin; formic acid ... See more keywords