Defect-free metallization of through-glass vias with engineered geometry in additive-free electrolyte
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DOI: 10.1016/j.elecom.2020.106823
Abstract: Abstract Defect-free metallization of through-glass vias (TGVs) with copper using an additive-free electrolyte is presented in this communication. Engineered vias with an X-shape in the middle were electroplated in the kinetic-limited regime (Thiele modulus, μ ≤ 1)… read more here.
Keywords: additive free; defect free; free metallization; geometry ... See more keywords