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Published in 2019 at "JOM"
DOI: 10.1007/s11837-019-03625-2
Abstract: The liquid/solid interfacial reactions of Sn, Sn-(3.0 wt.% to 0.5 wt.%)Cu (SAC), and Sn-9.0 wt.%Zn (SZ) solders with Ni-xPd-yCo substrates at 240°C, 270°C, and 300°C for 0.5 h to 5 h have been investigated. The…
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Keywords:
xpd yco;
free solders;
reactions lead;
interfacial reactions ... See more keywords
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Published in 2023 at "Crystals"
DOI: 10.3390/cryst13050789
Abstract: Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced soldering. They have excellent mechanical, electrical, and thermal properties and are primarily used to reinforce lead-free solders. This paper discusses the strengthening mechanism of…
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Keywords:
lead free;
carbon nanotubes;
composite solders;
cnt composite ... See more keywords