Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13122104
Abstract: In this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted… read more here.
Keywords: three step; glass; glass frit; frit bonding ... See more keywords