Sinter bonding and formation of a near-full-density bondline at 250 °C via addition of submicrometer Cu particles to micrometer Ag-coated Cu particles
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-04227-4
Abstract: Pressure-assisted die bonding at 250 °C in air using a paste containing 2 µm Ag-coated Cu particles (Cu@Ag) and 350 nm Cu particles was demonstrated for power device bonding. At a Cu@Ag-to-Cu mixing ratio of… read more here.
Keywords: near full; full density; coated particles; density bondline ... See more keywords
A Full Density Stereo Matching System Based on the Combination of CNNs and Slanted-Planes
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Systems, Man, and Cybernetics: Systems"
DOI: 10.1109/tsmc.2017.2767823
Abstract: Stereo matching methods consist of matching cost computation and several post processing steps. Deep learning methods have greatly raised the accuracy of matching cost and achieved the lowest error rate on several public datasets. However,… read more here.
Keywords: stereo matching; stereo; method; matching cost ... See more keywords