Fusion bonding of copper and silicon at -70 °C by electrochemistry
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DOI: 10.1016/j.actamat.2020.116486
Abstract: Abstract Wafer bonding processing typically employs thermal energy to fuse two surfaces by stimulating atomic interdiffusion at high temperatures. However, we found that the fusion bonding of copper and silicon can occur at an extremely… read more here.
Keywords: copper silicon; fusion bonding; electrochemistry; silicon ... See more keywords
A numerical illustration of the fusion bonding process
Sign Up to like & getrecommendations! Published in 2017 at "Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications"
DOI: 10.1177/1464420716665649
Abstract: Fusion bonding is an innovative joining technology which enables connecting load-adapted material combinations, such as metals with thermoplastic polymers or fibre-reinforced polymers. The bonding process is facilitated by inductively or conductively heating the metallic joining… read more here.
Keywords: process; fusion bonding; numerical illustration; bonding process ... See more keywords