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Published in 2020 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2020.113828
Abstract: Abstract The aim of this work is to present the optimization of the gate trench module for use in vertical GaN devices: we considered the impact of cleaning process of the etched surface of the…
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Keywords:
gan devices;
gate trench;
gate;
trench module ... See more keywords
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Published in 2017 at "IEEE Electron Device Letters"
DOI: 10.1109/led.2017.2720688
Abstract: GaN-based high electron mobility transistors (HEMTs) were fabricated on 200-mm silicon-on-insulator (SOI) substrates possessing multiple crystal orientations. These SOI substrates have the Si (100)-SiO2-Si (111) structure, which allows Si (111) to be exposed below the…
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Keywords:
integration;
integration gan;
gan devices;
200 platform ... See more keywords
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Published in 2018 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2017.2749249
Abstract: Gallium nitride (GaN) devices are suitable for high-frequency power converters due to their excellent switching performance. To maximize the performance of GaN devices, it is necessary to study the switching characteristics, which requires measuring the…
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Keywords:
fast gan;
switching current;
current measurement;
gan devices ... See more keywords
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Published in 2022 at "Crystals"
DOI: 10.3390/cryst12101461
Abstract: GaN-based high electron mobility transistors (HEMTs) are shown to have excellent properties, showing themselves to perform well among the throng of solid-state power amplifiers. They are particularly promising candidates for next-generation mobile communication applications due…
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Keywords:
dispersion suppression;
dispersion;
surface dispersion;
frequency ... See more keywords