A Comparative Study of Thermal Aging Effect on the Properties of Silicone-Based and Silicone-Free Thermal Gap Filler Materials
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DOI: 10.3390/ma14133565
Abstract: Thermal conductive gap filler materials are used as thermal interface materials (TIMs) in electronic devices due their numerous advantages, such as higher thermal conductivity, ease of use, and conformity. Silicone is a class of synthetic… read more here.
Keywords: filler materials; silicone based; gap filler; silicone free ... See more keywords