Effects of Additives in an Electrodeposition Bath on the Surface Morphologic Evolution of Electrodeposited Copper
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DOI: 10.20964/2021.02.40
Abstract: Additives in an electrodeposition bath have been frequently used to modulate the morphology of electrodeposited copper. The effects of gelatin, thiourea and chloride ions under various concentrations on electrodeposited copper were studied. The leveling and… read more here.
Keywords: copper; chloride ions; gelatin thiourea; electrodeposition bath ... See more keywords