Characterization of glass frit capillary pumps for microfluidic devices
Sign Up to like & getrecommendations! Published in 2019 at "Microfluidics and Nanofluidics"
DOI: 10.1007/s10404-019-2238-6
Abstract: Here, we report on a low-cost, disposable microfluidic pump made from sieved glass particles. The pump overcomes the limitations of other passive pumping methods and can handle whole blood, which makes it useful for point-of-care… read more here.
Keywords: glass frit; frit capillary; pumps microfluidic; capillary pumps ... See more keywords
Effect of composition of front-electrode-paste glass on electrical performance of multicrystalline silicon solar cells
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-6394-8
Abstract: In this study, the effects of Si/Pb ratio of Pb–Te–Si–O glasses on the electrical performance of multicrystalline Si solar cells were investigated. We first studied the relationship between the properties of glass frit (such as… read more here.
Keywords: glass frit; performance multicrystalline; glass; electrical performance ... See more keywords
Characterization of TeO2 based glass frits and morphology to their silver films
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7789-2
Abstract: Novel Pb-free Ag paste with a TeO2 based glass frit for front contact electrodes of crystalline silicon solar cells were prepared. The influence of TeO2 content (44–80 mol%) on thermal properties, structure and chemical durability of… read more here.
Keywords: glass frit; glass; teo2 content; teo2 based ... See more keywords
Laser sealing of organic light-emitting diode using low melting temperature glass frit
Sign Up to like & getrecommendations! Published in 2017 at "Optical and Quantum Electronics"
DOI: 10.1007/s11082-017-1046-z
Abstract: Glass frit encapsulation for laser-base sealing of the complex interiors results challenges for the electronics manufacturing process. The conventional frit packaging method relies on elevating thermal process by furnace where the package is heated to… read more here.
Keywords: temperature glass; glass frit; frit; laser ... See more keywords
Glass bonding with a reactive bonding layer fabricated by aerosol deposition
Sign Up to like & getrecommendations! Published in 2018 at "Ceramics International"
DOI: 10.1016/j.ceramint.2018.03.128
Abstract: Abstract The bonding temperature was lowered by placing intermediate layers that are reactive with a glass bonding frit. A dense reactive intermediate layer, ~ 6 µm in thickness, was anchored on STS304 by aerosol deposition (AD).… read more here.
Keywords: glass frit; glass; intermediate layer; aerosol deposition ... See more keywords
Preparation of highly dispersible glass frit powders and its application in ink-jet printing ink
Sign Up to like & getrecommendations! Published in 2020 at "Journal of The European Ceramic Society"
DOI: 10.1016/j.jeurceramsoc.2020.03.058
Abstract: Abstract The dispersion of low surface polarity ultra-fine powders has been a technical bottle-neck in many industrial applications, including ceramic or glass decoration and solar electrodes. Herein, we report a surface modification method to improve… read more here.
Keywords: glass frit; ink jet; glass; surface ... See more keywords
Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15082786
Abstract: Glass frit bonding is a widely used technology to cap and seal micro-electromechanical systems on the wafer level using a low melting point glass. Screen printing is the main method to apply glass frit paste… read more here.
Keywords: glass frit; wafer level; hermetic packaging; screen printing ... See more keywords
Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13122104
Abstract: In this work, void formation was systematically observed for the glass frit bonding technique as a function of the annealing temperature, annealing time, and annealing ambient. High annealing temperature and long annealing time were adopted… read more here.
Keywords: three step; glass; glass frit; frit bonding ... See more keywords