Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling
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DOI: 10.1109/temc.2016.2632703
Abstract: In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass interposer EBG structure for the first time. Glass interposer EBG… read more here.
Keywords: glass interposer; ebg structure; glass; sub ... See more keywords
Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer
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DOI: 10.1109/temc.2021.3059846
Abstract: In this article, we first measured through glass via (TGV) noise coupling and the effectiveness of shielding structures in a glass interposer. To analyze the noise coupling between signal TGVs, an open-ended structure is adopted.… read more here.
Keywords: noise coupling; glass interposer; shielding structures; signal tgvs ... See more keywords
Electrical–Thermal Characterization of Through Packaging Vias in Glass Interposer
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DOI: 10.1109/tnano.2017.2722686
Abstract: Low-cost thin glass is developed as a promising material to advanced interposers for high density electrical interconnection in 2.5-D and three-dimensional (3-D) integration. In this paper, the electrical–thermal performance of through glass vias is investigated.… read more here.
Keywords: tgvs; electrical thermal; glass; glass interposer ... See more keywords