In Situ Observation of Crystallization Dynamics and Grain Orientation in Sequential Deposition of Metal Halide Perovskites
Sign Up to like & getrecommendations! Published in 2019 at "Advanced Functional Materials"
DOI: 10.1002/adfm.201902319
Abstract: Metal halide perovskites have revolutionized the development of highly efficient, solution‐processable solar cells. Further advancements rely on improving perovskite film qualities through a better understanding of the underlying growth mechanism. Here, a systematic in situ… read more here.
Keywords: halide perovskites; metal halide; grain orientation; sequential deposition ... See more keywords
Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-6347-2
Abstract: In this paper, the grain orientation evolution of Pb-free solder joints during thermomechanical fatigue (TMF) was characterized quantitatively using in-situ electron backscattered diffraction (EBSD) observation, which was an effective way to clarify the mechanism of… read more here.
Keywords: grain orientation; solder joints; stress; solder ... See more keywords
Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests
Sign Up to like & getrecommendations! Published in 2017 at "Electronic Materials Letters"
DOI: 10.1007/s13391-017-7041-5
Abstract: The thermo-mechanical properties of microbumps serving as interconnects between Si chips in three-dimensional integrated circuits were examined in this study. Arrays of SnAg microbumps were subjected to temperature cycling tests up to 2500 cycles. Extensive… read more here.
Keywords: grain orientation; cycling; effect grain; cycling tests ... See more keywords
Grain orientation dependence of ω phase precipitation in ordered body-centered cubic NiTi based alloys
Sign Up to like & getrecommendations! Published in 2019 at "Intermetallics"
DOI: 10.1016/j.intermet.2019.02.014
Abstract: Abstract The grain orientation dependence of stress-induced ω phase transformation during tensile deformation was investigated in the ordered body-centered cubic (B2) NiTi based single crystal alloys fabricated by directional solidification. The results show that the… read more here.
Keywords: grain orientation; orientation dependence; orientation; niti based ... See more keywords
Microstructure evolution and deformation behaviors of AZ31 Mg alloy with different grain orientation during uniaxial compression
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2017.12.312
Abstract: Abstract Effect of grain orientation on deformation behaviors and microstructure evolution of rolled AZ31 Mg alloy during uniaxial compression have been investigated as a function of temperature and strain rate. Rectangular prism samples of rolled… read more here.
Keywords: compression; grain orientation; temperature; deformation ... See more keywords
Investigating the relationship between grain orientation and surface height changes in nickel polycrystals under tensile plastic deformation
Sign Up to like & getrecommendations! Published in 2019 at "Mechanics of Materials"
DOI: 10.1016/j.mechmat.2019.04.011
Abstract: Abstract This paper investigates the effect of the grain orientation on the surface roughening of nickel polycrystals undergoing plastic tensile deformation. Both experimental and simulation work was carried out. In the experiments, we measured the… read more here.
Keywords: surface height; topography; grain; grain orientation ... See more keywords
Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
Sign Up to like & getrecommendations! Published in 2017 at "Scripta Materialia"
DOI: 10.1016/j.scriptamat.2016.09.028
Abstract: Abstract The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may… read more here.
Keywords: grain orientation; orientation; effect grain; formation ... See more keywords
[Technical Note] The Effect of Variables on Laboratory Termite Testing: Part II—Effect of Grain Orientation of Test Blocks
Sign Up to like & getrecommendations! Published in 2020 at "Forest Products Journal"
DOI: 10.13073/fpj-d-20-00044
Abstract: The effect of test-block grain orientation on laboratory termite tests using American Wood-Preservers' Association Standard E1-97 was evaluated using Coptotermes formosanus. This research revealed that testing of samples with the 6-mm direction in either the… read more here.
Keywords: effect; grain orientation; test; laboratory termite ... See more keywords
Molecular Dynamics Simulations of the Tensile Mechanical Responses of Selective Laser-Melted Aluminum with Different Crystalline Forms
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DOI: 10.3390/cryst11111388
Abstract: The mechanical deformation of cellular structures in the selective laser melting (SLM) of aluminum was investigated by performing a series of molecular dynamics (MD) simulations of uniaxial tension tests. The effects of crystalline form, temperature,… read more here.
Keywords: columnar; selective laser; aluminum; grain orientation ... See more keywords
Grain Orientation Optimization of Two-Dimensional Grain Selector during Directional Solidification of Ni-Based Superalloys
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DOI: 10.3390/ma13051121
Abstract: The grain selection method is widely used in industry to produce Ni-based single crystal superalloys. A Z-form two-dimensional (2D) grain selector was designed to obtain high-quality single crystals. To control grain orientation deviation, one of… read more here.
Keywords: grain orientation; single crystal; two dimensional; grain ... See more keywords
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15145086
Abstract: Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain… read more here.
Keywords: grain orientation; solder joints; rich solder; solder ... See more keywords