A novel metallization process for soldering graphite to copper at low temperature
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2016.12.104
Abstract: Abstract A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 °C for 30 min using Sn0.3Ag0.7Cu- 9%Cr (wt. %) metal powders. The typical interfacial microstructure of the metallization interface was β-Sn/Cr3C2/graphite.… read more here.
Keywords: graphite copper; novel metallization; process soldering; metallization process ... See more keywords
Degradation kinetics of Ti-Cu compound layer in transient liquid phase bonded graphite/copper joints
Sign Up to like & getrecommendations! Published in 2018 at "Scientific Reports"
DOI: 10.1038/s41598-018-33446-3
Abstract: The continuous Ti-Cu compound layer produced in brazing of graphite to copper with Ti foil is found to be seriously detrimental to joint properties due to its brittleness. In this work, a transient liquid phase… read more here.
Keywords: degradation; transient liquid; graphite copper; copper ... See more keywords