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Published in 2024 at "Advanced Functional Materials"
DOI: 10.1002/adfm.202400980
Abstract: The innovation of 3D FinFETs using top‐down silicon nanofins represents a significant advancement toward scaling down microchip process nodes to the cutting‐edge 3‐nm level. While bottom‐up semiconductor nanofins also hold promise as building blocks for…
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Keywords:
atomic terraces;
graphoepitaxially side;
side side;
side nanofins ... See more keywords