Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-8096-7
Abstract: Micron level Cu-pillar microbumps, which appear as the size of three-dimensional packaging shrinks down, have to introduce many unexpected reliability problems. The fast growth of intermetallic compounds (IMC) and voids tend to be a serious… read more here.
Keywords: voids growth; intermetallic compound; investigation intermetallic; growth fine ... See more keywords
Controlled Growth of Fine Multifilaments in Polymer-based Memristive Devices Via the Conduction Control.
Sign Up to like & getrecommendations! Published in 2020 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.0c07533
Abstract: Solid polymer electrolyte(SPE) is one of the choices for many ionic devices, including organic transistors, ion batteries, memristors, and more. However, uncontrollable conductive filaments formation seriously affects the performance of the device. In this paper,… read more here.
Keywords: multifilaments polymer; fine multifilaments; growth fine; controlled growth ... See more keywords