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Published in 2021 at "ECS Journal of Solid State Science and Technology"
DOI: 10.1149/2162-8777/ac3058
Abstract: With the development of technology nodes below 5 nm, cobalt has attracted extensive attention as an interconnection metal to replace Cu in the next generation of interconnection technology. Here, the appropriate concentrations of colloidal silica,…
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Keywords:
polishing polishing;
mechanical polishing;
electrochemical mechanical;
h2o2 bta ... See more keywords