Integrated Microfluidic Cooling of Heterogeneous HBM–GPU Package With Die Height Difference
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DOI: 10.1109/tcpmt.2025.3605312
Abstract: System-level thermal management of heterogeneously integrated HBM–graphics processing unit (GPU) module with step height variance is analyzed in this article. Heterogeneous integration of high-powered chiplets with different functionalities and die sizes motivates the development of… read more here.
Keywords: microfluidic cooling; step; hbm gpu; hbm ... See more keywords