Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging
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DOI: 10.3390/ma15082786
Abstract: Glass frit bonding is a widely used technology to cap and seal micro-electromechanical systems on the wafer level using a low melting point glass. Screen printing is the main method to apply glass frit paste… read more here.
Keywords: glass frit; wafer level; hermetic packaging; screen printing ... See more keywords