Interface Modulation for the Heterointegration of Diamond on Si
Sign Up to like & getrecommendations! Published in 2024 at "Advanced Science"
DOI: 10.1002/advs.202309126
Abstract: Along with the increasing integration density and decreased feature size of current semiconductor technology, heterointegration of the Si‐based devices with diamond has acted as a promising strategy to relieve the existing heat dissipation problem. As… read more here.
Keywords: heterointegration; interface; sic interlayer; diamond ... See more keywords