Sign Up to like & get
recommendations!
0
Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2948522
Abstract: This article presents the design, fabrication, experimental characterization, and modeling analysis of the chip-level hotspot targeted liquid impingement jet cooling for high-power electronics. The hotspot targeted jet impingement cooling concept is successfully demonstrated with a…
read more here.
Keywords:
cooling high;
high power;
power;
chip ... See more keywords