Hexagonal TSV Bundle Topology for 3-D ICs
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Circuits and Systems II: Express Briefs"
DOI: 10.1109/tcsii.2016.2551552
Abstract: Through-substrate vias (TSVs) are key for enabling 3-D integrated circuits (ICs). A hexagonal topology for TSV bundles in 3-D ICs is introduced in this brief. The topology exhibits superior symmetry as compared to the standard… read more here.
Keywords: tsv bundle; hexagonal tsv; ics hexagonal; topology ... See more keywords